Developed to respond to some of the most challenging environments around-and above-the globe, Rockwell Collins' patented Direct Dry Film^TM bonding technology offers the latest advances in ruggedized displays for application in multiple markets.

This innovative, environmentally friendly display manufacturing process utilizes a reliable, cost-effective dry lamination method for minimum waste. In addition to superior durability, the technology is scalable for volume and size, and its high yield - nearly 100 percent - means lower life cycle cost, quick yet reliable production and higher performance for the life of the display with no delamination.

Direct Dry Film bonding is well-suited for applications that require demanding optical or environmental performance- from 3-D technologies to rugged touch screen tablet computing - and applications requiring precision alignment of multiple substrates. This technology, also available for licensing, is ideal for high volume bonding of small displays and difficult-to-produce large formats.

Advantages of Direct Dry Film bonding:

• Used on all glass types, plastics, LCD modules, touch panels
• Scalable for volume and size from 1" to 65" diagonally and beyond
• No lamination-induced birefringence
• Complete repairability
• Standard materials
• Extremely high yields >98 percent, high automation capability, short processing times
• Extreme environments (-55°C to +110°C)
• High strength
• Avionics-grade quality
• Environmentally green
• Lamination compatible to MIL-STD-810/DO-160